High definition automated X-Ray inspection (μAXI)
At Trizo, ensuring reliability and zero-defect manufacturing is a core priority.
Our investment in high-definition automated X-ray inspection (μAXI) gives us the capability to detect defects that are invisible to traditional optical inspection methods.
Our capabilities
- High-Resolution μAXI Technology: Enables detailed internal inspection of complex assemblies, including BGAs, QFNs, stacked components, and dense multilayer boards
- Offline Automated X-ray System: Our latest generation AXI equipment delivers exceptional clarity and repeatability while maintaining throughput efficiency
- Non-Destructive Analysis: Allows component and joint integrity to be validated without damaging assemblies
Why high definition X-Ray inspection matters
- Zero-Defect Manufacturing: μAXI helps identify hidden defects such as voids, insufficient solder, bridging, misalignment, and internal structural issues
- Risk Reduction: Early detection prevents downstream failures, improving long-term product reliability
- Critical for Complex Assemblies: Essential for high-density and fine-pitch designs where visual inspection alone is not enough
- Ideal for High-Reliability Sectors: Supports stringent requirements across aerospace, defence, medical, automotive, and industrial applications
Typical applications
- BGA, LGA, QFN and other hidden-joint components
- Multi-layer and high-density PCBs
- Verification of solder quality and internal structures
- Critical assemblies requiring detailed structural analysis
