ERSA Selective Soldering
At Trizo, our ERSA selective solder modules offer a tailored soldering solution that balances flexibility, throughput and quality. This allows us to deliver reliable, near-zero-defect soldering for demanding electronics manufacturing applications
- Precision Fluxing & Controlled Solder Wave: Our ERSA modules apply flux with high accuracy and maintain a tightly controlled solder wave height. This ensures consistent, clean solder joints and brings us as close as possible to zero-defect production.
- Dual-Pot Selective Soldering: The dual-pot configuration allows either: 1. Use of two different alloys in a single run (without time-consuming retooling), 2. Running both pots in parallel to double throughput when production volume demands
- Flexible & Scalable for Different Project Types: From small-batch prototypes to high-volume production runs, ERSA selective soldering adapts to the needs of each assignment while maintaining high quality and traceability
Why ERSA Selective Soldering Matters
At Trizo, our ERSA selective solder modules offer a tailored soldering solution that balances flexibility, throughput and quality. This allows us to deliver reliable, near-zero-defect soldering for demanding electronics manufacturing applications
- Consistency & Reliability: Precision fluxing and solder wave control reduce solder defects and rework, essential for mission-critical applications
- Reduced Thermal Stress: Targeted selective soldering avoids unnecessary thermal exposure to sensitive components or areas, improving overall assembly robustness
- Production Efficiency: Dual-pot capability and minimal changeover keep line uptime high, reducing lead times and supporting scalable manufacturing.
- Suitability for High-Reliability Sectors: Ideal for aerospace, defence, medical, automotive, nuclear and other sectors where assembly, quality, traceability and compliance are paramount
Typical Applications
- Mixed-technology PCBs requiring selective wave soldering (e.g., through-hole & surface mount)
- Assemblies with sensitive components where localised soldering is needed
- Multi-alloy assemblies (where different solder alloys are required on the same board)
- High-volume or repeatable production runs demanding reliability and reproducibility
